Precursor composition for positive photosensitive resin and...

Details Precursor composition for positive photosensitive resin and... Precursor composition for positive photosensitive resin and...

2005-08-23

2005-08-23

Chu, John S. (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Radiation modifying product or process of making

Screen other than for cathode-ray tube

C430S018000, C430S191000, C430S192000, C430S193000, C430S326000, C430S330000, C430S906000

Reexamination Certificate

active

06933087

ABSTRACT:
A positive photosensitive resin precursor composition which can be can be developed in an alkaline developer is provided. The positive photosensitive resin precursor composition comprises (a), one of (b1) and (b2), and (c):(a) a polyamic acid ester and/or a polyamic acid polymer, both of which are soluble in an alkaline aqueous solution;(b1) a phenolic-hydroxyl-group-containing thermally crosslinkable compound comprising an organic-group-R1-substituted methylol group represented by formula (1) (wherein R1is not a hydrogen atom),in-line-formulae description="In-line Formulae" end="lead"?CH2—OR1)  (1);in-line-formulae description="In-line Formulae" end="tail"?(b2) a thermally crosslinkable compound containing a ureal organic group substituted by an organic group R1and represented by formula (2)(c) an esterified quinone diazide compound.

REFERENCES:
patent: 5753407 (1998-05-01), Oba
patent: 6593043 (2003-07-01), Suwa et al.
patent: 2004/0023147 (2004-02-01), Hirano et al.

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