Metal fusion bonding – Process – Plural joints
Reexamination Certificate
2006-12-12
2006-12-12
Edmondson, Lynne R. (Department: 1725)
Metal fusion bonding
Process
Plural joints
C029S840000
Reexamination Certificate
active
07147141
ABSTRACT:
A method for providing an improved solder joint for a via-in-pad ball grid array package. One or more bonding pads are formed upon a substrate. One or more vias are formed through the substrate within the bonding pad. The vias are plugged with a via plug material. The via plug material is then preconditioned such that an amount of volatiles within the via plug material is reduced.
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Boggs David W.
Dungan John
Paek Gary
Sato Daryl
Blakely , Sokoloff, Taylor & Zafman LLP
Edmondson Lynne R.
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