Special receptacle or package – Holder for a removable electrical component – For a semiconductor wafer
Reexamination Certificate
2006-03-28
2006-03-28
Fidei, David (Department: 3728)
Special receptacle or package
Holder for a removable electrical component
For a semiconductor wafer
C206S710000, C206S454000, C211S041180
Reexamination Certificate
active
07017749
ABSTRACT:
A presser member (1) of the present invention is formed of different materials for the contacting part (5) to press-hold the precision substrates (15) and for the parts other than the contacting part (5). The presser member (1) is shaped from a thermoplastic elastomer for a rectangular frame part, and the contacting part (5) has a pair of structuring parts (4) provided in such a fashion as to inwardly extend from each of a pair of oppositely facing sides. A second contacting part (11) is formed in the extension peripheral part extending via a supporting part (10). The other parts are shaped from a thermoplastic resin. The aforementioned contacting part (5) is provided with grooves of a V-shaped cross section with inclinations changed in the middle for receiving the peripheries of precision substrates (15), and V-grooves for press-holding the peripheries of precision substrates are provided in resilient pieces (12) separated and protruding in a comb teeth-like fashion to form the second contacting part (11).
REFERENCES:
patent: 4061228 (1977-12-01), Johnson
patent: 5253755 (1993-10-01), Maenke
patent: 5273159 (1993-12-01), Gregerson
patent: 5555981 (1996-09-01), Gregerson
patent: 5749467 (1998-05-01), Gregerson
patent: 5845803 (1998-12-01), Saito et al.
patent: 6267245 (2001-07-01), Bores et al.
patent: 6273261 (2001-08-01), Hosoi
patent: 6505839 (2003-01-01), Nishimuro et al.
patent: 1049137 (2000-11-01), None
patent: 8-31920 (1996-02-01), None
patent: 8-255826 (1996-10-01), None
English Translation of Japanese Patent document 8-255826, “Semiconductor Wafer Housing Cassette”, Tsutomu Suzuki, et al. Oct. 1996.
Hosoi Masato
Kudo Hideo
Matsuo Takashi
Yajima Toshitsugu
Fidei David
Shin-Etsu Polymer Co. Ltd.
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