Precision spot plating process and apparatus

Details Precision spot plating process and apparatus Precision spot plating process and apparatus

1981-10-22

1983-01-04

Tufariello, T.

Chemistry: electrical and wave energy

Processes and products

204224R, C25D 508, C25D 1700

Patent

active

043671233

ABSTRACT:
A process and apparatus for electroplating a spot of metal on a substrate and optionally a plurality of such spots in a desired arrangement. A column of electrolyte having a transverse cross-sectional shape corresponding about to the shape of the desired spot of metal to be plated is formed between an anode and the substrate which is connected as a cathode. The electrolyte is supplied by force of gravity with a desired hydrostatic head pressure. The substrate can be sequentially advanced to electrodeposit spots of metal at different points on the substrate.

REFERENCES:
patent: 2750332 (1956-03-01), Miller
patent: 3468785 (1969-09-01), Polichette
patent: 3810829 (1974-05-01), Fletcher
patent: 3894918 (1975-07-01), Corby et al.
patent: 3957614 (1976-05-01), Corby et al.

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