Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material
Patent
1998-03-18
2000-12-12
Dutton, Brian
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
427597, 438940, H01L 2120, C23C 1414
Patent
active
061598321
ABSTRACT:
A process for providing precision deposits (3) of metal films unto a working substrate (5) by transmitting an ultrafast laser pulse thorough a transparent target substrate (6) whose lower surface supports a metal film (7). Rapid laser heating produces pressure that propels vaporized metal unto the working substrate whereupon the metal vapor rapidly resolidifies on a dimension substantially equal to the ultrafast laser's focal spot size.
REFERENCES:
patent: 4743463 (1988-05-01), Ronn et al.
patent: 4752455 (1988-06-01), Mayer
patent: 4880959 (1989-11-01), Baum et al.
patent: 4895735 (1990-01-01), Cook
patent: 4970196 (1990-11-01), Kim et al.
patent: 4987006 (1991-01-01), Williams et al.
patent: 5035202 (1991-07-01), Nishikawa et al.
patent: 5173441 (1992-12-01), Yu et al.
patent: 5246885 (1993-09-01), Braren et al.
patent: 5292559 (1994-03-01), Joyce et al.
patent: 5725706 (1998-03-01), Thoma et al.
patent: 5912915 (1999-06-01), Reed et al.
patent: 5935462 (1999-08-01), Tatah
patent: 5956354 (1999-09-01), Yan
Mallis et al., "Etching and printing of diffractive optical microstructures by a femtosecond excimer laser," Applied Optics, vol. 38, No. 11, pp. 2301-2308, Apr. 1999.
Liu et al., "Ultrashort laser pulses tackel precision machining, " Laser Focus World, pp. 101-118, Aug. 1997.
Liu et al., "Laser Ablation and Micromachining with Ultrashort Laser Pulses," IEEE Journal of Quantum Electronics, vol. 33, No. 10, pp. 1706-1716, Oct. 1997.
Perry et al., "Terawatt to Petawatt Subpicosecond Lasers," Science, vol. 264, pp. 917-924, May 1994.
F. J. Mayer and Gar. E. Busch, "Plasma production by laser-driven explosively heated thin metal films", Journal of Applied Physics, 57, 827 (1985), pp. 827-829.
A. B. Bullock, P. R. Bolton, and F. J. Mayer, "Time-integrated reflectivity of laser-induced back ablated aluminum thin film targets", Journal of Applied Physics, 82, 1828 (1997), pp. 1828-1831.
F. J. Adrian, J. Bohandy, B. F. Kim, and A. N. Jette, "A study of the mechanism of metal deposition by the laser-induced forward transfer process", Journal of Vacuum Science and Technology B 5, 1490 (1989), pp. 1490-1494.
Z. Toth, T. Szorenyi and A. L. Toth, "Ar.sup.+ laser-induced forward transfer (LIFT): a novel method for micrometer-size surface patterning", Applied Surface Science 69,317 (1993), pp. 317-320.
H. Esrom, J. Y. Zhang, U. Kogelschatz and A. J. Pedraza, "New approach of a laser-induced forward transfer for deposition of patterned thin metal films", Applied Surface Science 86, 202 (1995), pp. 202-207.
R. J. Baseman, A. Gupta, R.C. Sausa and C. Progler, in: Laser and Particle Beam Chemical Processing for Microelectronics, Eds. D. J. Ehrlich, G. S. Higashiand and M. M Oprysko, materials Research Society Symposium Proceedings 101, 237 91988), pp. 237-242.
W. H. Knox, "Practical Lasers Will Spawn Varied Ultrafast Applications" in Laser Focus World, p. 135, Jun. 1996, pp. 135-140.
Clark-MXR Inc., Dexter, Michigan, also the following publication, P. Bado, D. Du, E.F. Gabl, Y. Pang, E. Canto-Said, "Reliable Compact Ultrafast Sources", Ultrafast Phenomena, Tenth International Topical Meeting, May 28-Jun. 1, 1996.
Tolbert, W. A., Lee, S. I-Y., Wen, X., and Dlott, D., "Laser Ablation Transfer Imaging Using Picosecond Optical Pulses: Ultra-High Speed, Lower Threshold and Higher Resolution", Journal of Imaging Science and Technology 37, pp. 485-489 (1993).
Abstract of Paper CThA4 at the Conference of Lasers and Electro-Optics (Europe)--1998 p. 248, Papakonstantinou, P., Zergioti, I., Mailis, S., Ikiades, A., Kalpouzos, C., Vainos, N., "Femtosecond Laser Microprinting of Metal and Oxide Structures".
Part of PhD thesis of An-Chun Tien submitted to the University of Michigan, Mar. 1999, pp. 62-69.
LandOfFree
Precision laser metallization does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Precision laser metallization, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Precision laser metallization will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-216339