Precision 2-part epoxy dispensing apparatus and method

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222 52, 3644791, G06F 1900

Patent

active

058019510

ABSTRACT:
A liquid dispense system for dispensing a 2-part epoxy resin compound to form bond beads having weights on the order of 1-20 mg. The dispensing system includes an epoxy resin compound pre-mixing and loading station, an epoxy dispense time and dispense force calibration station, and a plurality of epoxy dispensing third stations. Throughout the process, critical dispense related data is recorded on, and retrieved from, an on-board semiconductor memory device mounted on, and maintained with, the portable dispense syringe structure. Since the viscosity of the mixed epoxy compound is changing over time, any dispensing of constant amounts of the epoxy compound requires adjustments to dispense time and dispense force. These adjustments are made at a dispense station and are based on a calibration sample taken at the calibration station. The calibration step involves dispensing a sample of the loaded epoxy compound in the dispense syringe, and recording data on the memory device pertaining to the number of shots dispensed to produce the sample, the time taken for each shot and the total weight of the sample. At a dispensing station, a process controller reads the recorded data on the memory device and determines the count-down status of the worklife time, prior to dispensing any epoxy compound. On the basis of the data, the adjusted dispense time and dispense force parameters for dispensing a particular bead weight of the epoxy compound are determined in accordance with the ongoing change in viscosity of the curing epoxy resin compound.

REFERENCES:
patent: 5154314 (1992-10-01), Van Wormer
patent: 5611784 (1997-03-01), Barresi et al.

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