Precise patterning of high-K films

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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C438S705000, C438S745000

Reexamination Certificate

active

06855639

ABSTRACT:
A high-K thin film patterning solution is disclosed to address structural and process limitations of conventional patterning techniques. Subsequent to formation of gate structures adjacent a high-K dielectric layer, a portion of the high-K dielectric layer material is reduced, preferably via exposure to hydrogen gas, to form a reduced portion of the high-K dielectric layer. The reduced portion may be selectively removed utilizing wet etch chemistries to leave behind a trench of desirable geometric properties.

REFERENCES:
patent: 6300202 (2001-10-01), Hobbs et al.
patent: 54024236 (1979-02-01), None
patent: 2153082 (1990-06-01), None
patent: 2000036572 (2000-02-01), None
patent: 2001213696 (2001-08-01), None

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