Geometrical instruments – Gauge – With calibration device or gauge for nuclear reactor element
Reexamination Certificate
2002-07-15
2004-05-11
Bennett, G. Bradley (Department: 2859)
Geometrical instruments
Gauge
With calibration device or gauge for nuclear reactor element
C033S645000
Reexamination Certificate
active
06732442
ABSTRACT:
TECHNICAL FIELD
The present invention relates generally to semiconductor wafer processing systems and devices. The present invention also relates to over head transport (OHT) systems and devices utilized in semiconductor wafer processing operations. The present invention additionally relates to door opener and load ports thereof utilized in semiconductor wafer processing operations. In addition, the present invention relates to devices and methods for adjusting and calibrating such load ports.
BACKGROUND OF THE INVENTION
The fabrication of electronic devices on substrates is typically performed utilizing semiconductor processing devices and systems. Such semiconductor processing devices and systems can take on various implementations, including single wafer systems and batch type systems. Single wafer systems or devices involve the processing of a single wafer in a processing chamber. Batch type systems or devices involve the processing of multiple wafers in a chamber apparatus. Despite system or device architecture disparities, substrates are generally delivered to the processing systems from a clean room utilizing standardized interfaces and wafer pods or cassettes.
Such systems are commonly utilized in the semiconductor manufacturing industry. Such systems may be entirely automated or may include human interaction. The level of human interaction with such systems can be a contributing factor to costs involved in the overall semiconductor fabrication process. In most systems, a human operator or factory automation can deliver multiple wafers loaded in wafer pods or cassettes to a loading mechanism which transfers the wafers from the clean room in a fabrication facility into the processing system without exposing the wafers to contaminants. The delivery of wafers between processing systems and the operation of pod doors has been standardized by an organization known as SEMI.
Recent advances in circuit design and processing technology have driven a significant decrease in the size of semiconductor devices. At the same time, chip makers are trying to increase the number of devices, which can be produced on a single wafer. Accordingly, wafer sizes have increased to 300 mm, thereby requiring larger systems, which increase the amount of fabrication facility floor space required to house the larger systems. Also, as the wafer size has increased, the handling of wafers has become more limited to factory automation, instead of manual handling, to accommodate the increase in size and weight of wafer pods.
FIG. 1
is a schematic top view of a representative prior art processing system
10
having a front-end staging area
12
, which mounts a plurality of wafer pod loading stations
14
through an interface wall
16
separating the clean room
18
from the gray area
20
where the processing system
10
is housed. A single wafer processing system may include one or more load lock chambers
22
, a central transfer chamber
24
and a plurality of processing chambers
26
mounted on the transfer chamber.
A robot
28
disposed in the front-end staging area
12
moves wafers from wafer pods disposed on the pod loading stations
14
into a load lock chamber
22
. A robot
30
disposed in the transfer chamber
24
moves wafers from a load lock chamber
22
into a processing chamber
26
. The pod loading stations
14
are generally disposed through an opening in the interface wall
16
and provide a movable door opener
32
, which can seal the opening in the interface wall
16
when a wafer pod is not positioned on the pod loading station
14
. An example of a movable door opener currently in use is the Applied Materials Door Opener (ADO) manufactured by Applied Materials, Inc. of Santa Clara, Calif. Note that the configuration depicted in
FIG. 1
is presented herein for illustrative purposes only and is not considered a limiting feature of the present invention.
There are several commercial pod loading stations available from manufacturers, such as Jenoptik/INFAB, ASYST, PRI Automation and DYFUKU. These pod loading stations are very similar in function and appearance as they are all designed to meet applicable SEMI standards for the interface to the processing system as well as the interface to the pod and the pod loading station as presented to the fabrication facility material transport system (AGV, OHT, PGV). These current designs share the following details: a mechanical interface to receive a pod using three pins as required by SEMI; a mechanism to latch the pod into place on the pod loader; a mechanism to grip a pod door and operate the pod door latch mechanism; and, a mechanism to remove the pod door and store the door out of the way of the pod opening to allow clear access to the wafers stored inside the pod. These existing designs all generally employ a mechanical motion, which latches the pod to a fixed position, grips and unlatches the pod door, pulls the pod door horizontally away from the pod (i.e., into the staging area
12
), and then lowers the pod door below the plane of the pod for storage of the door while allowing access to all wafer positions. The pod loading stations
14
are designed so that an operator or factory automation can deliver a wafer pod onto the pod loading station and the wafers can be unloaded into the semiconductor wafer processing system.
Based on the foregoing, it can be appreciated that in most over head transport (OHT) systems, SEMI standards must be met, including height, leveling, side-to-side, and front-to-back positioning. One of the problems with current OHT systems thus involves positioning. The ADO load port, for example, has a very rough, and simple mechanism for adjusting position, and also has few tolerances to adjusting the height and leveling position. In addition, such an ADO mechanism is difficult for adjusting the load port position. Fine tuning of the load port position can not be achieved. Calibration of such ADO mechanisms generally requires a great deal of time to calibrate the load port position. Additionally, the ADO mechanism requires at least two individuals to calibrate the load port position.
The present inventors have thus concluded that a need exists for a new mechanism, including a method thereof, for fine tuning the load port position. A precise and “smart” load port adjusting mechanism is thus required, including one that can handle larger tolerances for load port adjustments. In addition, it would be desirable to implement a load port adjusting mechanism that requires only one person to perform the adjustment and which also saves calibration time. The present inventors have overcome the drawbacks associated with prior art devices, such as the ADO mechanism by presenting an improved load port adjusting mechanism including a method thereof, which is disclosed and described herein.
BRIEF SUMMARY OF THE INVENTION
The following summary of the invention is provided to facilitate an understanding of some of the innovative features unique to the present invention, and is not intended to be a full description. A full appreciation of the various aspects of the invention can be gained by taking the entire specification, claims, drawings, and abstract as a whole.
It is therefore one aspect of the present invention to provide an improved semiconductor wafer processing apparatus and method.
It is yet another aspect of the present invention to provide an improved load port utilizing in semiconductor wafer processing operations.
It is still another aspect of the present invention to provide a calibration mechanism for load port adjustment.
It is also an aspect of the present invention to provide an improved calibration mechanism for fine tuning the position of a load port, including the height level, side-to-side and front-to-back positions of the load port.
The above and other aspects of the present invention can thus be achieved as is now described. An apparatus and method for adjusting the position of a load port utilized in a semiconductor wafer processing system is described herein. Generally, a door opener can be configured for o
Cheng Tung-Gan
Huang Hung-Tse
Lin Cheng-Chao
Lin Hsueh-Cheng
Tsai Chia-Fu
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