Precasting multi-layer PCB process

Details Precasting multi-layer PCB process Precasting multi-layer PCB process

2007-06-05

2007-06-05

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S902000, C029S846000, C029S848000, C174S250000, C264S139000, C264S272110, C427S097100, C427S135000

Reexamination Certificate

active

11100495

ABSTRACT:
A pre-casting multi-layer PCB process has steel plate mold engraved with circuitry and the epoxy coated on the mold for the epoxy to cover up a fiber glass substrate; conductive material coated on the epoxy to insert molding the former into the latter to form recessed circuitry; then baked and solidified, sandblasted to remove film for the conductive material to become conducted circuitry; the lamination made by layer for achieving even thinner PBC circuitry while maintaining sufficient structural strength.

REFERENCES:
patent: 4606787 (1986-08-01), Pelligrino
patent: 5240671 (1993-08-01), Carey
patent: 5333379 (1994-08-01), Odaira et al.
patent: 5731086 (1998-03-01), Gebhardt et al.
patent: 6797367 (2004-09-01), Ogawa et al.

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