Pre-treating solution for electroless plating

Details Pre-treating solution for electroless plating Pre-treating solution for electroless plating

1994-04-08

1996-10-29

Klemanski, Helene

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 111, C23C 1800

Patent

active

055693210

ABSTRACT:
A pretreating solution for electroless plating comprising sulfuric acid, a halide, an organic acid and water as a diluent functions as an adhesion accelerating agent without generating etching corrosion, has a long life and provides excellent adhesiveness of plated copper to both glass cloth and substrate resins.

REFERENCES:
patent: 4001470 (1977-01-01), Schulze-Berge
patent: 4181750 (1980-01-01), Beckenbaugh et al.
patent: 4182784 (1980-01-01), Krulik
patent: 4863758 (1989-09-01), Rhodenizer
patent: 5206052 (1993-04-01), Nakaso et al.
patent: 5254156 (1993-10-01), Nakaso et al.

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