Pre-stressed laminated lid for electronic circuit package

Details Pre-stressed laminated lid for electronic circuit package Pre-stressed laminated lid for electronic circuit package

1991-05-03

1993-12-07

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257704, H01L 2302

Patent

active

052685330

ABSTRACT:
A lid (2) for an electronic circuit housing (4) has inner (24) and outer (22) laminated layers that are formed from two different materials, joined to each other and bowed outward from the housing (4) so that the inner layer (24) is under tensile bending stress at the interface between the layers, and the outer layer (22) is under compressive bending stress at the interface. This forms a pre-stress on the lid that resists external loads, and causes the lid to deflect under loading in a linear, predictable and recoverable fashion. The lid is preferably formed by thermal bonding of two materials having different coefficients of thermal expansion, with the bow forming as the materials cool. In one example two different metals are used, and in another a metal is bonded to a glass-ceramic tape.

REFERENCES:
patent: 3405441 (1968-10-01), Asher et al.
patent: 3504096 (1970-03-01), Nagel
patent: 3538597 (1970-11-01), Leinkram et al.
patent: 3700788 (1972-10-01), Spurck
patent: 3848077 (1974-11-01), Whitman
patent: 4326095 (1982-04-01), Yamaguchi
patent: 4577056 (1986-03-01), Butt
patent: 4717948 (1988-01-01), Sakai et al.
patent: 4873615 (1989-10-01), Grabbe

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