Pre-processing wafer for the output currents of detection diodes

Facsimile and static presentation processing – Facsimile – Specific signal processing circuitry

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35821319, H01L 2978

Patent

active

050418904

ABSTRACT:
A wafer is provided for pre-processing the output currents of detection diodes subjected to thermal radiation, comprising an input stage for integrating the output currents of the diodes and an output stage delivering a signal related the incident radiation by a transfer function. It also comprises transistors for compressing the transfer function, the transistors conducting beyond a shunt threshold current less than a clipping threshold current and having a conduction resistance such as to shunt only a part of the integrated charges.

REFERENCES:
patent: 4856033 (1989-08-01), Hirota
patent: 4866496 (1989-09-01), Audier
patent: 4875101 (1989-10-01), Endo et al.
patent: 4908684 (1990-03-01), Koike et al.
patent: 4990985 (1991-02-01), Kamata

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