Pre-patterned circuit board device-attach adhesive transfer syst

Stock material or miscellaneous articles – Layer or component removable to expose adhesive – Halogen containing compound

Patent

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Details

428213, 428216, 428204, 428209, 428323, 428901, 174255, 156230, A61F 1302, H05K 102, B44C 117

Patent

active

049590081

ABSTRACT:
A pre-patterned circuit board device-attach transfer tape is described which allows a one step mounting of adhesive patterns on a circuit board in the desired configuration for later mounting of surface mounted devices (e.g., semiconductor dies) thereon. The tape product contains the adhesive pattern in a mirror image to that desired on the exposed surface of the circuit board. The product of the present invention is utilized by bringing the tape product into contact with the circuit board so that the adhesive on the carrier film bonds to the desired surface of the circuit board thereby bringing the adhesive patterns into the desired configuration desired on the circuit board. The use of pressure and, possibly, heat preferentially bonds the adhesive to the circuit board and allows for later stripping of the support film from the support film/adhesive/circuit board composite. This step leaves behind the desired adhesive configuration on the circuit board and allows for later bonding of appropriate surface mounted devices to the circuit board.

REFERENCES:
patent: 3676252 (1972-07-01), Allington
patent: 3703603 (1972-11-01), Levesoue et al.
patent: 3741786 (1973-06-01), Torrey
patent: 3910852 (1975-10-01), Lederman et al.
patent: 3950200 (1976-04-01), Muramato et al.
patent: 4050976 (1977-09-01), Reiters
patent: 4242400 (1980-12-01), Smith et al.
patent: 4254186 (1981-03-01), Acitelli et al.
patent: 4285433 (1981-08-01), Garrett, Sr. et al.
patent: 4377619 (1983-03-01), Schouhorn
patent: 4437140 (1984-03-01), Ohyama et al.
patent: 4606962 (1986-08-01), Reylek et al.
IBM-Technical Disclosure-Immendorfer, vol. 4, No. 12, May 1982, p. 18.

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