Pre-molded leadframe and method therefor

Details Pre-molded leadframe and method therefor Pre-molded leadframe and method therefor

2008-07-15

2008-07-15

Potter, Roy K (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S112000, C257S676000, C257S666000

Reexamination Certificate

active

07399658

ABSTRACT:
A method of manufacturing a pre-molded leadframe for use in a semiconductor package includes providing a leadframe having a die pad and a plurality of leads. A first molding material is formed in the leadframe to expose the upper surface of the die pad and the upper surfaces of the plurality of leads.

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