Patent
1983-11-21
1986-01-21
Davie, James W.
357 74, H01L 2356, H01L 2304
Patent
active
045660271
ABSTRACT:
A pre-matched module is provided for an ultra-high frequency diode with high heat dissipation, comprising a diode chip biassed by a connection and mounted inside a case formed by a metal base, a quartz ring and a metal cap. The base of the case comprises two fixed and metal-coated diamonds one of which has dimensions very much greater than those of the other central diamond, these two diamonds allowing the heat released by the diode to be removed to a maximum and allowing the cap to provide, because of its dimensions and those of the diamond and of the ring, good radial impedance transformation.
REFERENCES:
patent: 3872496 (1975-03-01), Potter
patent: 3974518 (1976-08-01), Lewis, Jr. et al.
patent: 4189342 (1980-02-01), Kock
Russell, E. M., and Thomson, I., Embedded Diamond Heat Sinks for Avalanche Diodes, Proceedings of the IEEE, Aug. 1972, vol. 60, No. 8.
English, D. L. et al., Improved Performance of Millimetre-Wave Impatt Diodes on Type II a Diamond Heat Sinks, Electronics Letters, Dec. 1976, vol. 12, No. 25.
Dymeut, J. C. et al., Continuous Operation of GaAs Junction Lasers on Diamond Heat Sinks at 200.degree. K., Applied Physics Letters, Nov. 1967, vol. 11, No. 9.
IEEE Transactions on Microwave Theory and Techniques, vol. MTT-27, No. 5, May 1979, NY, T. A. Midford et al., "Millimeter-Wave CW IMPATT Diodes and Oscillators", pp. 483-492.
Boudot Marianne
Heitzmann Michel
"Thomson-CSF"
Davie James W.
Economou Vangelis
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