Pre-formed chip carrier cavity package

Details Pre-formed chip carrier cavity package Pre-formed chip carrier cavity package

1989-03-10

1991-12-10

LaRoche, Eugene R.

357 70, 357 75, H01L 2328

Patent

active

050722832

ABSTRACT:
A flexible circuit film is used in a surface mountable pre-formed chip carrier cavity package as a direct interconnect between the integrated circuit chip and external bonding pads on a printed circuit board. The IC chip carrier of the present invention is comprised of a square or rectangular base having a central cavity; an IC chip mounted in the cavity and held therein by an adhesive; a lid having a complementary shape to the upper surface of the base; and a flexible circuit sheet sandwiched between the base and lid. The flexible circuit conforms to the top surface of the base due to various cuts or cutouts therein depending upon the specific package construction. Etched copper circuitry on the flex circuit forms interconnects between I/O pads on the IC chip and the outer periphery of the package. The package enables the use of more than 80 and up to more than 300 I/O leads per chip. The base, circuit film, and lid are bonded together with a suitable adhesive. Later the package may be surface mounted on a conventional printed circuit board by solder connections between the exposed leads at the outer periphery of the package and conductive areas on the PC board surface. Multi-chip packages are also included.

REFERENCES:
patent: 4661886 (1987-04-01), Nelson et al.
patent: 4820658 (1989-04-01), Gilder, Jr.
patent: 4872260 (1989-10-01), Johnson et al.
patent: 4903113 (1990-02-01), Frankeny et al.
IBM Technical Disclosure Bulletin, vol. 28, No. 12, May 1986, "Plastic Ringed High Density `J` Leaded Chip Carrier".

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