Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate
2007-02-20
2007-02-20
Chen, Jack (Department: 2813)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
C438S113000
Reexamination Certificate
active
10729176
ABSTRACT:
Singulating a wafer into individual die using a pre-scribing technique. Embodiments of the invention relate to scribing a wafer prior to the fabrication process in order to help preserve the integrity of the fabricated devices during singulation.
REFERENCES:
patent: 5414297 (1995-05-01), Morita et al.
patent: 5716495 (1998-02-01), Butterbaugh et al.
patent: 2004/0232524 (2004-11-01), Howard et al.
Chen Jack
Intel Corporation
Metzger Erik M.
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