Pre-coated particles for chemical mechanical polishing

Details Pre-coated particles for chemical mechanical polishing Pre-coated particles for chemical mechanical polishing

2007-06-12

2007-06-12

Marcheschi, Michael (Department: 1755)

Abrasive tool making process, material, or composition

With inorganic material

C051S308000, C051S309000, C427S212000, C427S215000, C427S220000, C427S221000, C427S248100, C427S255210, C427S255600, C427S427000, C106S003000

Reexamination Certificate

active

10307274

ABSTRACT:
The present invention relates to the manufacture and use of novel pre-coated abrasive particles and particle slurries for the chemical mechanical polishing (CMP) of semiconductor wafers, thin films, inter-layer dielectric, metals, and other components during integrated circuit, flat panel display, or MEMS manufacturing. For example, polishing slurry abrasive particles can be pre-coated with additives, such as, inhibitors and/or surfactants during manufacture of the abrasive particles or slurry. The additive's opportunity to react directly with the abrasive particles early in the particle manufacturing process provides a slurry having a more stable, selectable, and predictable ratio of abrasive particles pre-coated with a more stable, selectable, and predictable amount and type of additives.

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Copper and Tantalum Chemical-Mechanical Planarisation: Some Recent Progress, Ying Li & S. V. Babu, Clarkson University, Potsdam, NY, USA (Semiconductor Fabtech—13th Edition, pp. 259-261, no date.

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