Metal fusion bonding – Process – With protecting of work or filler or applying flux
Reexamination Certificate
2006-02-28
2006-02-28
Stoner, Kiley S. (Department: 1725)
Metal fusion bonding
Process
With protecting of work or filler or applying flux
C523S211000, C525S107000
Reexamination Certificate
active
07004375
ABSTRACT:
The present invention relates to a pressure sensitive fluxing underfill composition that may be pre-applied to electronic components, such as CSP's, in order to increase the reliability of the component against mechanical stresses such as impact and bending. The composition contains an epoxy resin, a solid anhydride curing agent, and catalyst. Other materials, such as air release agents and fillers, may also be added as desired. The composition may be applied selectively to parts of the CSP, for example to the solder bumps. The composition provides sufficient tack in order to hold the electronic assembly together during the assembly process.
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Shah Jayesh
Tong Quinn K.
Wheelock Brian
Almer Charles W.
National Starch and Chemical Investment Holding Corporation
Stoner Kiley S.
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