Pre-alloyed thick film conductor for use with aluminum wire bond

Details Pre-alloyed thick film conductor for use with aluminum wire bond Pre-alloyed thick film conductor for use with aluminum wire bond

1983-05-06

1985-05-14

Padgett, Ben R.

Stock material or miscellaneous articles

All metal or with adjacent metals

Having metal particles

419 9, 419 23, 252514, H01B 102, B22F 704, B32B 1502

Patent

active

045172528

ABSTRACT:
A thick film conductor material comprising metal particles containing both gold and at least one additional element prealloyed into a single particle. The additional element may preferably be Pd and the prealloying may preferably be accomplished by coprecipitation. The conductor material, when bonded with Al wire, impedes the growth of intermetallic compounds and subsequent Kirkendall voids, even at elevated temperatures.

REFERENCES:
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patent: 3778305 (1973-12-01), Holmes et al.
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patent: 4090009 (1978-05-01), Horowitz
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patent: 4293451 (1981-10-01), Ross
patent: 4309457 (1982-01-01), Kawasumi
patent: 4350618 (1982-09-01), Hilson et al.
"Thick Film Conductors Without Glass or Oxide Binders for Improved Wire Bonding in Multilayer Circuits", Riemer, Dietrich E. Proceedings of the 1979 International Microelectronics Symposium, pp. 143-147.
"High Reliability Wire Bonding in Multilayer Hybrid Circuits"; Steven C. Hugh et al.; 1982, IEEE, pp. 428-433.

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