Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-04-21
1999-07-20
Lorin, Francis J.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
29852, H05K 332
Patent
active
059252065
ABSTRACT:
A new method of preparing blind vias in printed circuit boards and other substrates allows for the drilling of holes for connection between conductive layers, in insulating layers prior to laminating insulating layers together. Each insulative layer is prepared with patterned conductive wiring and holes are drilled through the layer at points where wiring is to connect to another level of wiring. Two layers are aligned, using mechanical, optical, or other alignment mechanisms, and subsequently laminated together. The holes are plated with conductor after lamination to form an electrical connection. Additional layers can be added by the same method.
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Boyko Chris M.
Farquhar Donald S.
Stone David
Supa Richard J.
International Business Machines - Corporation
Lorin Francis J.
Samodovitz Arthur J.
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