Power surface mount light emitting die package

Details Power surface mount light emitting die package Power surface mount light emitting die package

2007-09-04

2007-09-04

Alavi, Ali (Department: 2875)

Illumination

Light source and modifier

With ventilating, cooling or heat insulating means

C257S098000, C257S100000

Reexamination Certificate

active

10446532

ABSTRACT:
A light emitting die package is disclosed. The die package includes a substrate, a reflector plate, and a lens. The substrate is made from thermally conductive but electrically insulating material. The substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a mounting pad. The reflector plate is coupled to the substrate and substantially surrounds the mounting pad. The lens is free to move relative to the reflector plate and is capable of being raised or lowered by the encapsulant that wets and adheres to it and is placed at an optimal distance from the LED chip(s). The lens can be coated with any optical system of chemical that affects the performance of the device. Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink). The reflector plate includes a reflective surface to direct light from the LED in a desired direction.

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