Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-11-07
2006-11-07
Cuneo, Kamand (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S797000, C361S701000, C361S709000, C361S710000
Reexamination Certificate
active
07133284
ABSTRACT:
The invention provides a power supply for a computer mainframe, which is cooled by a heat conduction method, and more particularly to a power supply without a cooling fan. The present invention features a highly effective heat pipe connecting a plurality of aluminum-extrusion heat sink fins and a plurality of aluminum-extrusion heat sinks, the aluminum-extrusion heat sink fins fixed above a cooling chip over a circuit board, and the aluminum-extrusion heat sinks fringed near the power supply, with a part of the heat sink fins exposed to the power supply. The heat of a chip is conducted out of the power supply by the aluminum-extrusion heat sink fins, the high-effect heat pipe, and the aluminum-extrusion heat sinks. Therefore, the power supply can reach an expected cooling effect without the cooling fan.
REFERENCES:
patent: 5170336 (1992-12-01), Getter et al.
patent: 5842514 (1998-12-01), Zapach et al.
patent: 6894900 (2005-05-01), Malone
patent: 2004/0085733 (2004-05-01), Leon et al.
patent: 2004/0184236 (2004-09-01), Lee
patent: 2005/0011199 (2005-01-01), Grisham et al.
Carpio Ivan
Cuneo Kamand
Etasis Electronics Corporation
Troxell Law Office PLLC
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