Power supply structure for multichip package

Details Power supply structure for multichip package Power supply structure for multichip package

1994-04-28

1995-12-12

Ledynh, Bot

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361775, 361794, 439 65, H05K 111

Patent

active

054755689

ABSTRACT:
A power supply structure for a multichip package is provided to improve the transmission performance of signals. Cases are fitted onto one face of a ceramic substrate. On the other face are aligned substrates. On each of the substrates are erected I/O pins. The I/O pins are connected to signal pins of LSIs via the ceramic substrate's internal layer. On side faces of the substrates are provided power supply pads. To the power supply pads are connected the power supply pins of the LSIs via the ceramic substrate's internal layer. When power is to be supplied, electroconductive bars are inserted between the substrates. The electroconductive bars supply power to the LSIs via the power supply pads. A cable is connected to one of the I/O pins.

REFERENCES:
patent: 4628411 (1986-12-01), Balderes et al.
patent: 4819131 (1989-04-01), Watari
patent: 4958258 (1990-09-01), Charruau

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