Metal fusion bonding – Process – With condition responsive – program – or timing control
Patent
1994-08-24
1997-01-21
Bradley, P. Austin
Metal fusion bonding
Process
With condition responsive, program, or timing control
2281101, B23K 2010
Patent
active
055953301
ABSTRACT:
The power supply includes a voltage controlled oscillator, two potentiometers and a by-pass circuit coupled to the output of the voltage controlled oscillator. The two potentiometers form two channels, channel 1 and channel 2, one of which will be selected during the bonding cycle to be coupled to a power amplifier. The output of the power amplifier is adapted to be coupled to an ultrasonic transducer for operating the transducer. Selectable channel 1 and channel 2 reference voltage devices are provided. The voltage and current applied to the amplifier are converted to power. During a bonding cycle, a comparator compares the power applied to the transducer with that of a selected reference voltage and varies the output of the potentiometer of the selected channel to maintain the output of the power amplifier constant during bonding. Also provided is a switching arrangement for coupling the by-pass circuit to the power amplifier at the initial part of a bonding cycle and for coupling the potentiometers the selected channel 1 or channel 2 to the power amplifier such that a maximum burst of energy is applied to the transducer initially during the bonding cycle and then the desired voltage level from the selected channel 1 or channel 2 is applied to the transducer.
REFERENCES:
patent: 4696425 (1987-09-01), Landes
patent: 4993618 (1991-02-01), Toyozawa et al.
patent: 4998664 (1991-03-01), Gibson et al.
patent: 5046654 (1991-09-01), Yamazaki et al.
patent: 5213249 (1993-05-01), Long et al.
patent: 5314105 (1994-05-01), Farassat
patent: 5433369 (1995-07-01), Okumura
Alfaro Cesar
Buice David
Whelan Mike
Bradley P. Austin
Knapp Jeffrey T.
Verity Instruments Inc.
Zobal Arthur F.
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