Power stack

Details Power stack Power stack

2007-04-03

2007-04-03

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S698000, C361S699000, C361S718000, C257S675000, C257S686000, C257S714000, C165S080400, C338S053000, C338S319000

Reexamination Certificate

active

11129371

ABSTRACT:
A power stack includes cooling pipes and semiconductor modules which are alternately laminated. Each cooling pipe includes an inside space dissected into cooling passages in which coolant flows. Both surfaces of the semiconductor module in a laminating direction are brought into contact with surfaces of neighboring cooling pipes. The semiconductor modules are classified into a plurality of groups mutually differentiated in their heat generation rates. And, any two semiconductor modules belonging to the same group having the highest heat generation rate are spaced from each other so that a cooling pipe is not sandwiched between these semiconductor modules in the laminating direction.

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U.S. Appl. No. 10/733,472, filed Dec. 12, 2003, Sakai.
Translation of Jan. 5, 2007 Office Action from corresponding Japanese priority application.

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