Power sink for IC temperature control

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

08030952

ABSTRACT:
The use of a power sink function in IC testing results in a simple and rapid method for testing ICs, and assembled modules, at elevated temperature profiles without the use of environmental ovens. Testing IC devices at elevated temperatures may be useful for ‘burn-in’, for ‘hot sort’ performance testing that may be used in electronic devices such as DRAM memory, logic, communication devices, and microprocessors. The power sink function may be implemented as an additional isolated area of active devices, or as a section of the circuit that is not involved in the testing procedure. Alternately, the power dissipation circuit may consist of a resistive path between two external pins that are not used for IC operation, where the resistor may be on the IC or on the package. This allows for control of the temperature level and profile by simple adjustment of the voltage between the two external pins.

REFERENCES:
patent: 3235803 (1966-02-01), Imai et al.
patent: 3659199 (1972-04-01), Knutson
patent: 4078720 (1978-03-01), Nurnberg
patent: 4114096 (1978-09-01), Chinery
patent: 4165642 (1979-08-01), Lipp
patent: 4497998 (1985-02-01), West
patent: 4593208 (1986-06-01), Single
patent: 4661771 (1987-04-01), Nakamura
patent: 4734872 (1988-03-01), Eager et al.
patent: 4768170 (1988-08-01), Hoff
patent: 4999813 (1991-03-01), Ohtsuka et al.
patent: 5298433 (1994-03-01), Furuyama
patent: 5309090 (1994-05-01), Lipp
patent: 5406212 (1995-04-01), Hashinaga et al.
patent: 5414370 (1995-05-01), Hashinaga et al.
patent: 5483175 (1996-01-01), Ahmad et al.
patent: 5490059 (1996-02-01), Mahalingaiah et al.
patent: 5502397 (1996-03-01), Buchanan
patent: 5517053 (1996-05-01), Dietz et al.
patent: 5610529 (1997-03-01), Schwindt
patent: 5768570 (1998-06-01), Kobayashi et al.
patent: 5790780 (1998-08-01), Brichta et al.
patent: 5927512 (1999-07-01), Beffa
patent: 5951893 (1999-09-01), Bitko et al.
patent: 6046433 (2000-04-01), Gross et al.
patent: 6441897 (2002-08-01), Zeimantz
patent: 6459292 (2002-10-01), Oikawa et al.
patent: 6489793 (2002-12-01), Jones et al.
patent: 6549026 (2003-04-01), DiBattista et al.
patent: 6587980 (2003-07-01), Debenham
patent: 6644098 (2003-11-01), Cardinale et al.
patent: 6650132 (2003-11-01), Pelissier
patent: 6674623 (2004-01-01), Abe et al.
patent: 6815643 (2004-11-01), Der Ropp
patent: 6825681 (2004-11-01), Feder et al.
patent: 6861860 (2005-03-01), Maggi et al.
patent: 6866416 (2005-03-01), Mahanpour et al.
patent: 6934645 (2005-08-01), Kim
patent: 6944567 (2005-09-01), Beffa
patent: 7008804 (2006-03-01), Song et al.
patent: 7023229 (2006-04-01), Maesaki et al.
patent: 2005/0270049 (2005-12-01), Kishishita
patent: 2007/0030019 (2007-02-01), Kinsley

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Power sink for IC temperature control does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Power sink for IC temperature control, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Power sink for IC temperature control will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4288414

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.