Power semiconductors connected antiparallel via heatsinks

Details Power semiconductors connected antiparallel via heatsinks Power semiconductors connected antiparallel via heatsinks

1987-12-29

1989-09-05

Larkins, William D.

357 76, 357 81, H01L 2346, H01L 2348, H01L 2342, H01L 2516

Patent

active

048643858

ABSTRACT:
A semiconductor device is provided which includes first and second semiconductor elements of different types stacked alternately. A plurality of cooling members are each disposed between the paired first and second semiconductor elements located adjacent to each other for cooling the semiconductor elements and electrically connecting the elements to each other. In other words, the cooling members will have one of the first semiconductor elements on one side and one of the second semiconductor elements on the other side. At least one connecting conductor is provided for connecting at least one of the first semiconductor elements and at least one of the second semiconductor elements in an anti-parallel connection and also for connecting a plurality of the anti-parallel connections in series to one another. Because the first and second semiconductor elements are of different types from one another which are placed under a maximum load at different times, the cooling members will not be subjected to a maximum load on both sides at the same time. Therefore, the size of the cooling member can be decreased because it will only have to provide maximum cooling to one of the first and second semiconductor elements at a time.

REFERENCES:
patent: 4492975 (1985-01-01), Yamada et al.
patent: 4574877 (1986-03-01), Klein
patent: 4628219 (1986-12-01), Troscinski
patent: 4694323 (1987-09-01), Itahana et al.
patent: 4745315 (1988-05-01), Terry, Jr. et al.

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