Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2007-08-28
2010-11-09
Lee, Calvin (Department: 2892)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C257S727000
Reexamination Certificate
active
07829386
ABSTRACT:
A semiconductor chip packaging structure is fabricated by using a dielectric film with two surfaces, and a power semiconductor chip with an active surface having contact pads. An adhesive layer is used to connect the first surface of the dielectric film and the active surface of the power semiconductor chip. A patterned electrically conductive layer is formed adjacent to the second surface of the film, extending through holes in the film to the contact pads.
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Beaupre Richard Alfred
Elasser Ahmed
Fillion Raymond Albert
Korman Charles Steven
Wojnarowski Robert John
Clarke Penny A.
General Electric Company
Lee Calvin
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