Power semiconductor package

Details Power semiconductor package Power semiconductor package

2005-09-13

2008-12-16

Ho, Hoang-Quan (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S734000, C257S745000, C257S791000, C257SE23044, C257SE23071

Reexamination Certificate

active

07466012

ABSTRACT:
A power semiconductor package that includes a semiconductor die having at least two power electrodes and a conductive clip electrically and mechanically coupled to each power electrode.

REFERENCES:
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patent: 2001/0042906 (2001-11-01), Nakamura et al.
patent: 2002/0011651 (2002-01-01), Ichinose
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patent: 2004/0104791 (2004-06-01), Satoh et al.
patent: 2004/0212017 (2004-10-01), Mizuno et al.
patent: 2006/0081985 (2006-04-01), Beach et al.
International Search Report dated Apr. 19, 2006 from the corresponding PCT Application No. PCT/US05/32743.

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