Power semiconductor package

Details Power semiconductor package Power semiconductor package

2007-04-24

2007-04-24

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000, C257SE23037

Reexamination Certificate

active

10896375

ABSTRACT:
A semiconductor package including a relatively thick lead frame having a plurality of leads and a first lead frame pad, the first lead frame pad including a die coupled thereto, bonding wires connecting the die to the plurality of leads, the bonding wires being aluminum, and a resin body encapsulating the die, bonding wires and at least a portion of the lead frame.

REFERENCES:
patent: 6211462 (2001-04-01), Carter et al.
patent: 6249041 (2001-06-01), Kasem et al.
patent: 6396127 (2002-05-01), Munoz et al.
patent: 6400004 (2002-06-01), Fan et al.
patent: 2003/0011051 (2003-01-01), Woodworth et al.
patent: 2005/0145998 (2005-07-01), Harnden et al.

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