Power semiconductor package

Details Power semiconductor package Power semiconductor package

1989-07-18

1990-05-01

Envall, Jr., Roy N.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

H01L 2336, H05K 720

Patent

active

049223798

ABSTRACT:
A hermetically sealed power semiconductor package includes a body 11 and a thick metal back 24. The metal back serves as a mounting device as well as a thermal channel for the package eliminating the need for intermediate heatsinks. For example, fasteners 47 extending into the back 24 can be used to mount the package to a printed wiring board 38 and directly to a heatsink 44.

REFERENCES:
patent: 4577402 (1986-03-01), Swanstrom
patent: 4669028 (1987-05-01), Faa, Jr.
patent: 4803590 (1989-02-01), Fassel et al.
patent: 4833569 (1989-05-01), Probst

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