Power semiconductor module with temperature measurement

Thermal measuring and testing – Temperature measurement – By electrical or magnetic heat sensor

Reexamination Certificate

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Details

C374S141000, C374S172000, C327S513000, C702S130000, C323S907000, C361S093800, C324S762010, C257S467000

Reexamination Certificate

active

08057094

ABSTRACT:
A power semiconductor module with temperature measurement is disclosed. One embodiment provides a conductor having a first end and a second end. The second end is thermally coupled at a substrate. A device including temperature sensor is thermally coupled at the first end and configured to determine a temperature at the second end using the temperature sensor.

REFERENCES:
patent: 4001649 (1977-01-01), Young
patent: 4157466 (1979-06-01), Herrin
patent: 4730228 (1988-03-01), Einzinger et al.
patent: 4860165 (1989-08-01), Cassinelli
patent: 5101315 (1992-03-01), Ishikawa et al.
patent: 5245510 (1993-09-01), Honda
patent: 5313150 (1994-05-01), Arakawa et al.
patent: 5483102 (1996-01-01), Neal et al.
patent: 5563760 (1996-10-01), Lowis et al.
patent: 5570027 (1996-10-01), Stans et al.
patent: 5663574 (1997-09-01), Hierold et al.
patent: 5696543 (1997-12-01), Koizumi et al.
patent: 5721455 (1998-02-01), Takashita
patent: 5886515 (1999-03-01), Kelly
patent: 6092927 (2000-07-01), Clemente
patent: 6144246 (2000-11-01), Wachter
patent: 6717788 (2004-04-01), Sommer et al.
patent: 6747572 (2004-06-01), Bocko et al.
patent: 6787870 (2004-09-01), Wienand et al.
patent: 6791063 (2004-09-01), Manthe
patent: 6854881 (2005-02-01), Nada
patent: 7304264 (2007-12-01), Roy
patent: 7307328 (2007-12-01), Meyer et al.
patent: 7396156 (2008-07-01), Uraki
patent: 7448797 (2008-11-01), Horn
patent: 7507023 (2009-03-01), Oyabe et al.
patent: 7528645 (2009-05-01), Scheikl et al.
patent: 2001/0048708 (2001-12-01), Mikubo et al.
patent: 2002/0167065 (2002-11-01), Graf et al.
patent: 2004/0207965 (2004-10-01), Ausserlechner
patent: 2005/0197799 (2005-09-01), Kamezawa et al.
patent: 2005/0199999 (2005-09-01), Shirasawa et al.
patent: 2009/0024345 (2009-01-01), Prautzsch
patent: 2009/0102493 (2009-04-01), Disney et al.
patent: 2009/0161726 (2009-06-01), Miyamoto et al.
patent: 19959985 (2001-07-01), None
patent: 10210181 (2003-07-01), None
patent: 2007194442 (2007-08-01), None

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