Power semiconductor module with cooling element and pressing...

Details Power semiconductor module with cooling element and pressing... Power semiconductor module with cooling element and pressing...

2006-04-25

2006-04-25

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S675000

Reexamination Certificate

active

07034395

ABSTRACT:
A semiconductor power module (1) comprises at least a substrate (2) including at least a semiconductor element (6, 7, 8) and a pressing device (40) which acts on the substrate (2). The pressing device (40) enables to press the substrate (2), when mounted, on a cooling element (30) so as to evacuate from semiconductor components operational heat losses. The pressing device (40) consists of a housing (10) provided with at least an elastic deformation zone (16, 17, 15, 18, 19).

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