Power semiconductor module with a plurality of semiconductor chi

Details Power semiconductor module with a plurality of semiconductor chi Power semiconductor module with a plurality of semiconductor chi

1998-06-29

2000-05-09

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

257691, 257722, 257723, H01L 2302, H01L 2348, H01L 2352

Patent

active

060607726

ABSTRACT:
On a metal base, an insulated wiring substrate is fixed, and, on a conductive layer on the insulated wiring substrate, semiconductor chips are disposed. Above the semiconductor chips, a controlling substrate is provided, and the signals produced in this controlling substrate are supplied to electrodes on the surfaces of the semiconductor chips via bonding wires passing through openings provided in the controlling substrate.

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patent: 5521437 (1996-05-01), Oshima et al.
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patent: 5621243 (1997-04-01), Baba et al.
patent: 5920119 (1999-07-01), Tamba et al.
patent: 5942797 (1999-08-01), Terasawa

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