Power semiconductor module method

Details Power semiconductor module method Power semiconductor module method

2007-10-18

2010-12-14

Loke, Steven (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S122000

Reexamination Certificate

active

07851267

ABSTRACT:
A method for assembling a power module includes providing a casing with a plurality of receiving elements. At least one substrate carrying at least one semiconductor chip is provided within the casing. At least one support element is provided. An elastically stressed cover is arranged over the at least one support element, and the cover is released so that the elastically stressed cover is restrained by the at least one support element and the plurality of receiving elements.

REFERENCES:
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patent: 5621243 (1997-04-01), Baba et al.
patent: 5699232 (1997-12-01), Neidig et al.
patent: 6087682 (2000-07-01), Ando
patent: 6791183 (2004-09-01), Kanelis
patent: 7023056 (2006-04-01), Liaw
patent: 2005/0230807 (2005-10-01), Kodani et al.

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