Power semiconductor module having a plastic housing a metal/cera

Details Power semiconductor module having a plastic housing a metal/cera Power semiconductor module having a plastic housing a metal/cera

1995-12-26

1997-12-16

Tolin, Gerald P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 522, 257687, 361715, H05K 720

Patent

active

056992327

ABSTRACT:
A power semiconductor module includes a plastic housing having a bottom plane in which a substrate is disposed. Disposed inside the module are the substrate, structures on the substrate, a rubber-like soft encapsulation and a hard encapsulation above the soft encapsulation. Internal struts of the housing extend into the soft encapsulation and, if appropriate, have ends with transverse extensions disposed within the soft encapsulation. The effect of this module construction is that a back pressure or reaction opposes forces acting externally on the substrate.

REFERENCES:
patent: 4436951 (1984-03-01), Rief
patent: 4514587 (1985-04-01), Soerewyn
patent: 4558510 (1985-12-01), Tani
patent: 4639759 (1987-01-01), Neidig
patent: 4670771 (1987-06-01), Neidig
patent: 4731644 (1988-03-01), Neidig
patent: 5296739 (1994-03-01), Heilbronner
patent: 5563380 (1996-10-01), Rostoker

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