Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1997-02-21
1999-07-06
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257719, 257727, 257726, 257723, 257712, 257693, 257728, 257678, H01L 2312, H01L 2348, H01L 2308
Patent
active
059201193
ABSTRACT:
A power semiconductor module having a power circuit unit; a metal base for sealing the bottom of the module; an insulation substrate for electrically insulating the metal base from the power circuit unit; external input and output terminals connected to the power circuit unit; a resin case in which the external input and output terminals are inserted by integral molding; and a resin encapsulant material has been improved substantially in its reliability through provision of a nut integrally molded with the resin case for fastening the external input and output terminals with a screw; a metal base inserted in the resin case by integral molding; and a recess to receive the end of the screw located immediately below the nut, the recess extending without penetrating the resin case, and the metal base extending to an area below the recess.
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Saito Ruichi
Sasaki Masataka
Shigemura Tatsuya
Sonobe Yukio
Suzuki Kazuhiro
Hitachi , Ltd.
Williams Alexander Oscar
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