Power semiconductor module and method for producing the module

Details Power semiconductor module and method for producing the module Power semiconductor module and method for producing the module

1988-05-19

1990-11-13

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 72, 361386, 361385, H05K 720

Patent

active

049705768

ABSTRACT:
A power semiconductor module and method for producing the module includes a plastic housing having a lower surface. An electrically insulating substrate having an upper surface is inserted in the lower surface of the plastic housing for supporting electrical components. A metallization is disposed at least on the upper surface of the substrate. The metallization on the upper surface of the substrate is patterned to form conductor tracks. Components are soldered onto the patterned metallization. Locating compartments disposed in the plastic housing form a soldering jig for the components during production of the module.

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patent: 4768075 (1988-08-01), Broich et al.
patent: 4788626 (1988-11-01), Neidig et al.

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