Power semiconductor module

Details Power semiconductor module Power semiconductor module

2007-05-09

2009-02-24

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S712000, C257S723000

Reexamination Certificate

active

07495324

ABSTRACT:
A power semiconductor module having an electrically insulating substrate, to be arranged with a circuit board. The circuit board is spaced apart from the substrate by a housing. First conductor tracks are disposed inside the substrate, facing the circuit board, for receiving power semiconductor devices which can be driven by a control IC device. Second conductor tracks are provided on the inside of the circuit board facing the substrate. In the housing, elastic connecting elements are pressure-contacted by a rigid pressure body to establish electrical connection between the first and second conductor tracks. An optimum electromagnetic compatibility is achieved due to the fact that IC conductor tracks and the control IC device are also provided on the inside of the substrate.

REFERENCES:
patent: 4047242 (1977-09-01), Jakob et al.
patent: 6291880 (2001-09-01), Ogawa et al.
patent: 103 16 355 (2004-07-01), None
patent: 103 06 643 (2004-08-01), None

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