Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-11-06
2007-11-06
Ho, Tu-Tu (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S704000, C257S718000, C257S724000, C257SE23193
Reexamination Certificate
active
11297980
ABSTRACT:
A power semiconductor module has a substrate (1) on which several pressure elements (16, 17, 18, 19) perform a mechanical pressure (F) at different areas (10, 11, 12, 13) thereof in a direction of a cooling element in order to press the underside (1b) of the substrate and reject heat towards said cooling element. In order to apply an essentially even and non-influenced by the component tolerances force to each area of the substrate, the pressure elements perform an elastic action on the substrate areas. The pressure elements (16, 17, 18, 19) are formed on the first part (21) of a housing which is movable with respect to the second part (22) thereof provided with spacing elements (30, 31, 32, 33) defining a supporting surface (34) in such a way that the first part (21) of the housing is fixed at a certain distance from the substrate (1).
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PCT International Search Report application No. PCT/EP2004/003375, 4 pages, mailing date Jul. 16, 2004.
Coats & Bennett P.L.L.C.
EUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH
Ho Tu-Tu
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