Power semiconductor module

Details Power semiconductor module Power semiconductor module

2005-10-25

2005-10-25

Ngô, Ngân V. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S690000, C257S698000, C257S700000, C257S723000, C257S724000

Reexamination Certificate

active

06958534

ABSTRACT:
A power semiconductor module has a base plate comprising a framelike housing, a cap, and at least one electrically insulated substrate disposed inside the housing. The substrate comprises an insulation body with a plurality of metal connection tracks located thereon and insulated from one another, power semiconductor components located on the connection tracks, and terminal elements leading to the outside of the power semiconductor module for load and auxiliary contacts. Some of these terminal elements in the interior of the power semiconductor module comprise contact springs, which are disposed between the connection tracks and contact points on a printed circuit board. The printed circuit board has conductor tracks, which connect the contact points to contact elements that lead to the outside of the power semiconductor module.

REFERENCES:
patent: 6222264 (2001-04-01), O'Neal et al.
patent: 6373125 (2002-04-01), Pannaccione et al.
patent: 6563217 (2003-05-01), Corisis et al.
patent: 2002/0149102 (2002-10-01), Hashemi et al.
patent: 2004/0026778 (2004-02-01), Grant
patent: 42 37 632 (1994-05-01), None
patent: 196 30 173 (1998-01-01), None

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