Power semiconductor module

Details Power semiconductor module Power semiconductor module

1996-02-06

1998-04-28

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With means to prevent explosion of package

257704, 257787, H01L 2312

Patent

active

057448604

ABSTRACT:
A power semiconductor module (201) is disclosed comprising at least one semiconductor chip, which is arranged on a baseplate (202) and is surrounded by a housing (204) arranged above the baseplate (202), and which can be externally connected by means of connecting lugs (205). The connecting lugs (205) are electrically connected to the at least one semiconductor chip and are routed to the outside through corresponding through-passage openings (210) in the housing (204). An explosion of the module in the event of a disturbance is reliably prevented or its effect is largely attenuated as a result of the fact that the connecting lugs (205) are constructed as parts of connection laminates (206), which are arranged inside the housing (204) and parallel to the baseplate (202) and are mechanically connected to the latter over a large area.

REFERENCES:
patent: 5473191 (1995-12-01), Tanaka

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