Power semiconductor module

Details Power semiconductor module Power semiconductor module

2011-07-19

2011-07-19

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S712000, C257S717000, C257S722000, C257SE23079, C257SE23080, C361S717000

Reexamination Certificate

active

07982299

ABSTRACT:
Included are a semiconductor package, a first bus bar, a second bus bar and a soldering control unit. The semiconductor package includes a power semiconductor element, a first electrode plate and a second electrode plate. The first bus bar is a conductive member which is soldered onto the main surface of the first electrode plate through a first solder member. The second bus bar is a conductive member which is soldered onto the main surface of the second electrode plate through a second solder member. The soldering control unit is provided on each of the main surface of the first bus bar to which the first electrode plate is soldered and the main surface of the second bus bar to which the second electrode plate is soldered, and controls the solder joint thickness.

REFERENCES:
patent: 2006/0164813 (2006-07-01), Yoshioka et al.
patent: 1783471 (2006-06-01), None
patent: 2002-164485 (2002-06-01), None
patent: 2003-10064 (2003-01-01), None

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