Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-01-24
2006-01-24
Smoot, Stephen W. (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C361S783000, C174S264000
Reexamination Certificate
active
06989590
ABSTRACT:
A power semiconductor device according to the present invention comprises at least one insulating substrate; at least one power semiconductor element mounted on a metal pattern formed on the main surface of the insulating substrate; and a control circuit board which is arranged so that its first surface can oppose the above main surface of the insulating substrate with the power semiconductor element interposed therebetween, and which has at least one electronic component for control, mounted on a metal pattern formed on its second surface in parallel to the above first surface, and at least one through hole formed vertically to the first and second surfaces so as to electrically connect circuit patterns laminated between the first surface and the second surface, and this power semiconductor device is characterized in that the above through hole is filled with a filler.
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patent: 5444297 (1995-08-01), Oshima et al.
patent: 6421244 (2002-07-01), Shinohara et al.
patent: 6633005 (2003-10-01), Ichitsubo et al.
patent: 6774465 (2004-08-01), Lee et al.
patent: 2001/0008483 (2001-07-01), Lee et al.
patent: 8-32240 (1996-02-01), None
Hanada Hironobu
Koutake Yasuo
Mitsubishi Denki & Kabushiki Kaisha
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
Smoot Stephen W.
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