Power semiconductor device package

Details Power semiconductor device package Power semiconductor device package

2007-09-18

2007-09-18

Ha, Nathan W. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

Reexamination Certificate

active

10867758

ABSTRACT:
A power semiconductor device package according to one aspect of the present invention comprises: a plurality of power semiconductor chips which are arranged in a laminated structure so that the plurality of power semiconductor chips are opposing to each other at the surfaces with the same electrical structures, and which are connected in parallel to one another, and are sealed in a sealing resin as one body.

REFERENCES:
patent: 6426560 (2002-07-01), Kawamura et al.
patent: 6707138 (2004-03-01), Crowley et al.
patent: 7030501 (2006-04-01), Yoshiba et al.
patent: 2003/0042437 (2003-03-01), Worley et al.
patent: 2003/0075785 (2003-04-01), Crowley et al.
patent: 2002-208673 (2002-07-01), None
patent: 2002-217416 (2002-08-01), None
patent: 2003-197859 (2003-07-01), None

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