Power semiconductor device, armoring case thereof and method for

Details Power semiconductor device, armoring case thereof and method for Power semiconductor device, armoring case thereof and method for

1996-03-12

1998-10-20

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257723, 257698, H01L 2312

Patent

active

058250859

ABSTRACT:
The present invention implements an armoring case of a power semiconductor device which can prevent cracks from occurring by inserting the terminal portion of an electrode plate in the inserting hole of the armoring case and then bending the same, misregistration from occurring between the fastening bolt inserting hole of the terminal portion and the screw portion of a terminal nut, and the like, and which can easily be assembled automatically. A terminal nut cover is previously molded. The terminal nut cover includes a first concave portion which can cover and support the terminal nut so as not to rotate when fastening a bolt, and a second concave portion into which the tip of the screw portion of the bolt can project. The electrode plate whose terminal portion is previously bent into a predetermined shape by a press machine or the like, and the terminal nut cover having the terminal nut inserted in and supported by the first concave portion are provided in a metal mold for the armoring case. The electrode plate and the terminal nut cover are insert-molded integrally with the armoring case, so that the armoring case of the power semiconductor device can be molded.

REFERENCES:
patent: 5646445 (1997-07-01), Masumoto

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