Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2006-08-08
2006-08-08
Baumeister, B. William (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257SE23010
Reexamination Certificate
active
07087990
ABSTRACT:
A power semiconductor device to which a large current can be applied and which can be fabricated compactly in a shorter time, including an electrode structure for taking out electrodes from a power semiconductor element mounted on one of a plurality of circuit patterns formed on an insulating substrate inside of a case up to an external-connection terminal exposed outside of the case, and an external-connection terminal insert-formed on the body of the case, exposed to the outside of the case at one end of the terminal and having a junction portion at its other end joined to a circuit pattern different from the circuit pattern on which the power semiconductor element is mounted. The junction portion is directly connected with the power semiconductor element through a wire member bonded to the face opposite to the junction face of the terminal.
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Baumeister B. William
Farahani Dana
Mitsubishi Denki & Kabushiki Kaisha
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
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