Power semiconductor component with a power semiconductor...

Details Power semiconductor component with a power semiconductor... Power semiconductor component with a power semiconductor...

2007-03-30

2010-06-29

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With means for controlling lead tension

C257S666000, C257S669000, C257SE23031

Reexamination Certificate

active

07745913

ABSTRACT:
A power semiconductor component includes at least one power semiconductor chip and surface-mountable external contacts. The power semiconductor chip includes large-area contact areas on its top side and its rear side, which cover essentially the entire top side and rear side, respectively. The top side also includes, alongside the large-area contact area, a small-area contact area; the areal extent of the small-area contact is at least ten times smaller than the areal extent of the large-area contact areas. The small-area contact area is connected to an individual external contact of the power semiconductor component via a bonding wire connection. The large-area contact area of the top side is connected to external contacts via a bonding tape.

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