Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2007-12-13
2010-06-01
Andújar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S341000, C257S401000
Reexamination Certificate
active
07728415
ABSTRACT:
A power semiconductor component stack, using lead technology with surface-mountable external contacts, includes at least two MOSFET power semiconductor components each having a top side and an underside. The underside includes: a drain external contact area, a source external contact area and a gate external contact area. The top side includes at least one source external contact area and a gate external contact area. The gate external contact areas on the top side and the underside are electrically connected to one another. The power semiconductor component stack is a series circuit or a parallel circuit of MOSFET power semiconductor components arranged one above another in a plastic housing composition.
REFERENCES:
patent: 5532512 (1996-07-01), Fillion et al.
patent: 6040626 (2000-03-01), Cheah et al.
patent: 6249041 (2001-06-01), Kasem et al.
patent: 6319755 (2001-11-01), Mauri
patent: 6593622 (2003-07-01), Kinzer et al.
patent: 6992386 (2006-01-01), Hata et al.
patent: 7042086 (2006-05-01), Shimoida et al.
patent: 7633141 (2009-12-01), Huber
patent: 2004/0063240 (2004-04-01), Madrid et al.
patent: 2004/0169289 (2004-09-01), Satou et al.
patent: 2005/0023658 (2005-02-01), Tabira et al.
patent: 2005/0023670 (2005-02-01), Hata et al.
patent: 2005/0275082 (2005-12-01), Ferrara et al.
patent: 2006/0237814 (2006-10-01), Hosseini et al.
patent: 2007/0200250 (2007-08-01), Koenigsberger et al.
patent: 2007/0266558 (2007-11-01), Otremba
patent: 2008/0224300 (2008-09-01), Otremba
patent: 2009/0039484 (2009-02-01), Mahler et al.
patent: 2009/0189259 (2009-07-01), Mohamed et al.
patent: 10134943 (2002-10-01), None
Hosseini Khalil
Koenigsberger Alexander
Mahler Joachim
Otremba Ralf
Schiess Klaus
Andújar Leonardo
Arroyo Teresa M
Edell Shapiro & Finnan LLC
Infineon - Technologies AG
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